Laser Marking

A laser scriber that can digitally control the position and trajectory of the cutting scribe can be used for wafer and semiconductor material cutting, eliminating the cumbersome process of traditional crystal source knife and saw cutting. Widely used in solar industry monocrystalline silicon, polycrystalline silicon, amorphous silicon solar cells (cell) and wafers

★ Equipped with precision mobile platform to ensure machining accuracy

★ With pulse laser, it can complete the processing in an instant, and the          heat affected area is very small, ensuring the processing accuracy

★ Non-contact machining No cutting force acting on the cutting part,              avoiding damage to the surface of the processed material

specification

1. Wavelength =  532nm (3W)

2. Marking area : 80cm x 80cm

3. speed: 100 mm/sec (Max speed)

4. Precision: 0.0006 mm/mm of travel

System composition

Real machine